SEMICONDUCTOR MEMS CLEANING EQUIPMENT

MLO

MLO

Next generation hybrid type Lift-Off Equipment combining batch and single-wafer type

MLO Photo

The accuracy of process time management is greatly improved while utilizing the advantages of both the batch type and the single-wafer type.
Reduction in transfer errors is achieved by the horizontal multi-joint robot and the unique equipment configuration.

Features

High Processing Capacity 1.3 times higher throughput than conventional systems
Higher Quality by Stabilizing the Dipping Time Reduction in quality variations by our unique dipping time management method
Low Consumption Flash Processing Reduction in the amount of chemicals by efficient injection system
Chemical Recovery Rate of 90% or Higher Environmentally Friendly Structure
Separate Room Design Prevention of contamination-related problems between chambers

Supported processes

Lift-Off / Resist Stripping / Polymer Removal