SEMICONDUCTOR MEMS CLEANING EQUIPMENT

Batch-type Lift-Off Equipment that achieves uniform lift-off in a short period of time by combining the four forces of oscillation, ultrasonic wave, swelling, and down-flow. The multi-axis driven ultrasonic system contributes to batch-to-batch uniformity.

It achieves a high lift-off efficiency by adopting a dipping process despite being a single-wafer type, which has not been offered with conventional single-wafer type equipment. A unique special ultrasonic method allows it to efficiently remove resist and metal film.

This offers a damage-less processing by the resist swelling method which is gentle to patterns. The down-flow system in the tank of the single-wafer specification suppresses agitation of sludge to reduce scratches on the pattern.

Capable of processing thin wafers by adopting the damage-less stripping method, spraying together with special reinforcement plates. High stripping efficiency allows a chemical stripping with low environmental impact.

A new type of Lift-Off Equipment which has combined features of batch dipping processing and single-wafer spray processing. Quality is stabilized by controlling the dipping time for each single wafer. High recyclability with a chemical recovery rate of over 90% taking account of environmental aspects.

The down-flow system prevents polymers from floating in the tank to reduce reattachment. Optional ultrasonic systems and showers are available to improve polymer removal efficiency.

High penetration and drying properties achieve cleaning of fine and fragile structures while suppressing water marks on the wafer surface. This is equipped with systems for chemical circulation, recovery, and reuse to reduce the running cost of chemicals.