SEMICONDUCTOR MEMS CLEANING EQUIPMENT

This prevents stacking and collapse of fine patterns and cleaning failure of high aspect ratio patterns by the use of HFE (hydrofluoroether) with high volatility and low surface tension.
The unique chemical recycling mechanism offers a reduction in running costs.
The next-generation batch cleaning equipment that contributes to the safety and the environment.

Features

Supporting High-Aspect Ratio Patterns	Smooth penetration of chemicals between fine patterns to remove polymers
Reduction in Stiction of the Structure	Elimination of concerns about pattern collapse by the effective use of chemicals in the unique process
Reduction in Chemical Consumption	Unique chemical recycling method contributing to lower running costs

Supported processes

Polymer Removal / Structure Drying