SEMICONDUCTOR MEMS CLEANING EQUIPMENT

CLO

Cup Type Single Wafer Lift-Off Equipment

Single wafer lift-off processor with stability and stripping power

Photo

Despite of being a single-wafer type, completely dipping wafers in chemicals ensures the liquid temperature stability, ultrasonic attachability, and ultrasonic efficiency that could not be achieved with conventional single-wafer systems, thereby greatly improving the lift-off efficiency.

Features

Special Shape of Chamber Swelling and spinning allowed by the cup shape
Precision Finish Cleaning Damage-less and precision finishing allowed by flash spray
Prevention of Reattachment Centrifugal force-based liquid removal system is adopted

Supported processes

Lift-Off / Resist Stripping / Polymer Removal / Particle Removal