SEMICONDUCTOR MEMS CLEANING EQUIPMENT

BSP

Brush Scrub Processor

A single type brush scrub processor for a surface treatment and a treatment on both sides that supports multiple wafer sizes

BSP Photo

It allows customers to perform a treatment on both sides with roll brush and surface treatment with two-fluids.
This achieves processing of wafers with different diameters (4 inch/6 inch or 6 inch/8 inch) without changing setup. It is also applicable to particle removal before wafer loading in the MEMS and LED fields.

Features

Contamination Control in Scrubbing Unit Separately cleaning in each process allows customers to prevent contamination by configuring the L/D and scrubbing units as a two-line system
Flexible Choice of Brushes In addition to PVA brushes, urethane brushes, etc. can be chosen. Capable of processing wafers with different diameters
Handling Wafers with Different Diameters Capable of changing of wafer size between 4 inch / 6 inch and 6 inch / 8 inch without setup changes
High Throughput by Simultaneous Cleaning of Both Sides Higher throughput than conventional scrubbers, allowed by simultaneously cleaning the front and back sides
Diverse Process Selection Available for options to select the spin unit, such as two-fluid JET and megasonic cleaning

Supported processes

Particle Removal / Post-CMP Cleaning for Slurry Removal